STM961-15B rf power module digital cellular applications n linear power amplifier n 915-960 mhz n 26 volts n input/output 50 ohms n pout = 42 dbm cw or pep n gain = 30 db description the STM961-15B module is designed for digital cellular radio base station applications in the 915-960 mhz frequency range operating at 26v. the STM961-15B is designed to meet the low distortion, high linearity requirements of modern digital cellular base station equipment. pin connection june 1999 absolute maximum ratings (t case = 85 o c) symbol parameter value unit v s1, v s2 dc supply voltage 28 vdc v b dc bias voltage 28 vdc p in rf input power 14 dbm cw p out rf output power (v = 26v) 43 dbm cw t stg storage temperature - 30 to + 100 o c case style h110 ? order code branding STM961-15B STM961-15B 1. rf input 3.v b , 26v 2. v s1, 26v 4. rf output 1/7
electrical specification (t case = -10 o c to +85 o c, v s1 = 26 v, v b = 26 v to 27 v) dynamic symbol parameter test conditions min. typ. max. unit bw frequency range 915 960 mhz g p power gain p out = +42 dbm cw 28 30 db h efficiency p out = +42 dbm cw 32 35 % vswr p out = +42 dbm cw z s , z l = 50 w 2:1 vswr i q quiescent current p in = 0 dbm 580 ma 2f o harmonics p out = +42 dbm cw -30 dbc 3f o harmonics p out = +42 dbm cw -50 dbc f gain flatness p out = +42 dbm cw 1 db p 1db output power @ 1 db compression 41 dbm load mismatch vswr = 3:1 p out = +42 dbm cw no degradation in output power stability p out = +10 dbm to +42 dbm load vswr = 3:1 all phase angles all spurious outputs more than 60db below carrier module dc and test fixture configuration ref. 1017332i ref. 1 014532d STM961-15B 2/7
power gain vs output power output power [dbm] powergain[db] 10 20 30 34 36 38 40 42 29 30 31 32 33 34 f=960 mhz tcase= +85 deg.c tcase= +25 deg.c tcase= -10 deg.c 27.0 v 27.0 v 26.0 v 25.0 v 25.0 v 27.0 v 26.0 v 25.0 v 26.0 v power gain vs frequency & temperature 3rd order imd vs output power & temperature pep [dbm] 3rd imd [dbt] 20 22 24 26 28 30 32 34 36 38 40 42 -26.5 -31.5 -36.5 -41.5 -46.5 freq.=915 mhz vs=26.0 v tcase=+85 deg.c tcase=+25 deg.c tcase=-10 deg.c power gain vs output power output power [dbm] powergain[db] 10 20 30 34 36 38 40 42 29.5 30.5 31.5 32.5 33.5 34.5 f=915 mhz tcase=+85 deg.c tcase=+25 deg.c tcase=-10 deg.c 27.0 v 27.0 v 26.0 v 26.0 v 25.0 v 25.0 v 27.0 v 26.0 v 25.0 v 3rd order imd vs output power & temperature pep [dbm] 3rd imd [dbt] 20 22 24 26 28 30 32 34 36 38 40 42 -25 -30 -35 -40 -45 -50 freq.=960 mhz vs=26.0 v tcase=+85 deg.c tcase=+25 deg.c tcase=-10 deg.c 5th order imd vs output power & temperature pep [dbm] 3rd imd [dbt] 20 22 24 26 28 30 32 34 36 38 40 42 -33 -38 -43 -48 -53 -58 freq.=960 mhz vs=26.0 v tcase=+85 deg.c tcase=+25 deg.c tcase=-10 deg.c frequency [mhz] powergain[db] 900 910 920 930 940 950 960 970 980 29 30 31 32 33 34 po=42 dbm cw vs=26.0 v tc=-10 deg.c tc=+25 deg.c tc=+85 deg.c typical performance see note 1 see note 1 see note 1 STM961-15B 3/7
output power [dbm] cw efficiency [%] 32 34 36 38 40 42 7 12 17 22 27 32 37 freq.=960 mhz vs=26.0 v tcase=+85 deg.c tcase=+25 deg.c tcase=-10 deg.c 5th order imd vs output power & temperature pep [dbm] 3rd imd [dbt] 20 22 24 26 28 30 32 34 36 38 40 42 -33 -38 -43 -48 -53 -58 freq.=915 mhz vs=26.0 v tcase=+85 deg.c tcase=+25 deg.c tcase=-10 deg.c efficiency vs frequency frequency [mhz] efficiency [%] 900 910 920 930 940 950 960 970 980 34.5 35.5 36.5 37.5 38.5 vs=25.0 v vs=26.0 v vs=27.0 v tcase=+25 deg.c po=42 dbm cw cw efficiency vs output power & temperature cw efficiency vs output power & temperature output power [dbm] cw efficiency [%] 32 34 36 38 40 42 7 12 17 22 27 32 37 freq.=915 mhz vs=26.0 v tcase=+85 deg.c tcase=+25 deg.c tcase=-10 deg.c vswr vs frequency & temperature frequency [mhz] vswr 900 910 920 930 940 950 960 970 980 1 1.2 1.4 1.6 1.8 2 vs=26.0 v po=42 dbm cw tcase=+85 deg.c tcase=+25 deg.c tcase=-10 deg.c note (1) : two-tone test; 20khz separation; imd (in dbt) is referenced to the individual tone level. typical performance see note 1 STM961-15B 4/7
applications recommendations operation limits the STM961-15B power module should never be operated under any condition which exceeds the absolute maximum ratings presented on this data sheet. nor should the module be operated continuously at any of the specified maximum ratings. if the module is to be subjected to one or more of the maximum rating conditions, care must be taken to monitor other parameters which may be affected. decoupling failure to properly decouple any of the voltage supply pins will result in oscillations at certain operating frequencies. therefore, it is recommended that these pins be bypassed as indicated in the module dc and test fixture configuration drawing of this data sheet. module mounting to insure adequate thermal transfer from the module to the heatsink, it is recommended that a satisfactory thermal compound such as dow corning 340, wakefield 120-2 or equivalent be applied between the module flange and the heatsink. the heatsink mounting surface under the module should be flat to within 0.05mm ( 0.002 inch). the module should be mounted to the heatsink using 3.5 mm (or 6-32) or equivalent screws torqued to 5-6 kg-cm (4-6 in-lb). the module leads should be attached to equipment pc board using 180 c solder applied to the leads with a properly grounded soldering iron tip, not to exceed 195 c, applied a minimum of 2 mm (0.080 inch) from the body of the module for a duration not to exceed 15 seconds per lead. it is imperative that no other portion of the module, other than the leads, be subjected to temperatures in excess of 100 c (maximum storage temperature), for any period of time, as the plastic moulded cover, internal components and sealing adhesives may be adversely affected by such conditions. due to the construction techniques and materials used within the module, reflow soldering of the flange heatsink or leads, is not recommended. thermal considerations it will be necessary to provide a suitable heatsink in order to maintain the module flange temperature at or below to maximum case operating temperature. in a case where the module output power limited to +42 dbm cw and designing for the worst case efficiency of 32%, the power dissipated by the module will be 33.6 watts. the heatsink must be designed such that the thermal rise will be less than the difference between the maximum operating case temperature of the module while dissipating 33.6 w. at t case = +85 o c, v = 26v, z l = 50 w and p out = 42 dbm, maximum junction temperatures for the individual transistors should be below the following values: q1 = 140 o c, q2 = 145 o c, q3 = 130 o c. STM961-15B 5/7
dim. mm inch min. typ. max. min. typ. max. a 48.01 48.51 1.890 1.910 b 29.72 30.22 1.170 1.190 c 15.12 15.49 0.595 0.610 d 8.89 9.55 0.350 0.376 e 3.05 3.42 0.120 0.135 f 4.06 0.160 g 0.13 0.38 0.005 0.015 h 40.64 1.600 j 35.94 1.415 k 33.40 1.315 m 15.62 0.615 n 13.08 0.515 p 0.38 0.63 0.015 0.025 q 3.81 4.06 0.150 0.160 r 17.40 19.55 0.685 0.770 s 8.77 9.77 0.345 0.385 t 4.52 5.72 0.178 0.225 1014273h h110 mechanical data STM961-15B 6/7
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